Broadband LWIR C-IHET FPA for Discrimination Seekers

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0017
Agency Tracking Number: B074-003-0018
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2007
Solicitation Year: 2007
Solicitation Topic Code: MDA07-T003
Solicitation Number: N/A
Small Business Information
INTELLIGENT EPITAXY TECHNOLOGY, INC.
1250 E. Collins Blvd., Richardson, TX, 75081
DUNS: 059803945
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Paul Pinsukanjana
 VP of Tech./Bus. Dev.
 (972) 234-0068
 pinsu@intelliepi.com
Business Contact
 Yung-Chung Kao
Title: President/CEO
Phone: (972) 234-0068
Email: kao@intelliepi.com
Research Institution
 UNIV. OF ILLINOIS AT CHICAGO
 Mitra Dutta
 ECE Dept. (MC154)
851 South Morgan Street
Chicago, IL, 60607 7053
 (312) 355-2131
 Nonprofit college or university
Abstract
This Phase I STTR proposes to develop Focal Plane Array (FPA) based on Corrugated-Infrared Hot Electron Transistor (C-IHET) technology as a passive sensor for discrimination seekers. The initial goal of achieving high sensitivity with operating temperature >77K for C-IHET in the 8 - 12 µm LWIR spectral region will be investigated. This IHET effort will be developed in collaboration with the US Army Research Laboratory (ARL) and L-3 Communication Cincinnati Electronics (CE). GaAs-based IHET epitaxy materials will be developed using multi-wafer production Molecular Beam Epitaxy (MBE) reactor at IntelliEPI. University of Illinois at Chicago (UIC) will lead the device/epi structure design and optimization effort. Non destructive epitaxy materials characterization will be performed by IntelliEPI. UIC will characterize IHET test device for optical and electrical properties. UIC will develop processes for the epi wafers to create FPA die with the corrugated coupling geometry design. The process will be developed based on device fabrication facility at ARL. As proof of concept, CE will hybridize a C-IHET FPA to a fan-out or specially modified Read-Out Integrated Circuit (1024x768 format ROIC). UIC will work with ARL and CE to characterize a hybridized C-IHET FPA. The results will be compared with a comparable QWIP FPA.

* information listed above is at the time of submission.

Agency Micro-sites

SBA logo
Department of Agriculture logo
Department of Commerce logo
Department of Defense logo
Department of Education logo
Department of Energy logo
Department of Health and Human Services logo
Department of Homeland Security logo
Department of Transportation logo
Environmental Protection Agency logo
National Aeronautics and Space Administration logo
National Science Foundation logo
US Flag An Official Website of the United States Government