Reflective Arrayed Waveguide Gratings for Dense Communication, Sensing, and Signal Processing Systems

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$70,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
DASG60-03-P-0290
Award Id:
69441
Agency Tracking Number:
B031-1854
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
650 Vaqueros Ave., Suite A, Sunnyvale, CA, 94085
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
877452664
Principal Investigator:
BehzadMoslehi
President/CEO
(408) 328-8648
bm@ifos.com
Business Contact:
BehzadMoslehi
President/CEO
(408) 328-8648
bm@ifos.com
Research Institute:
n/a
Abstract
IFOS proposes to design and simulate photonic integrated circuits for dense communication, sensing, and signal processing systems. Photonic Integrated Circuits (PICs) are key elements of modern optical communication, sensing and signal processing. Arrayed Waveguide Gratings (AWGs) are state-of-the-art optical devices that are built on a PIC chip. They are used for multiplexing and demultiplexing, and as a building block for more complicated devices such as, variable optical attenuator, thermo-optic switch, optical channel monitor, etc. AWGs can also be optimized for specific systems such as multi-channel optical sensors and signal processors, making them ideal for multiplexed long-range sensing networks that require high volumes of data traffic. Such networks can be highly useful in applications such as missile tracking and detection systems. IFOS proposes a novel silica-on-silicon design of Reflective AWGs (RAWGs) that is suitable for fabrication on commercial fab facilities. In addition, a conventional Transmissive AWG (TAWG) is designed and simulated. The RAWG proposed here offers attractive benefit by reducing chip size to almost half of that of a TAWG and exhibits improved device performance. The developments anticipated in this proposal will result in a smart design of optimized photonic integrated circuit structures that can be fabricated with the help of a commercial fab facility. Two different class of structures will be investigated: a conventional, two-slab, transmissive AWG (TAWG) and a novel reflective AWG (RAWG). The RAWG structure proposed here will reduce the chip size by almost 50% and thereby significantly increase the yield of device per wafer. The proposed RAWG structure is unique and will allow more reliable packaging arrangement with improved product specification. The unique design and technological advantage offered by this product is expected to gain significant market potential in the optical communication industry, as well as for defense and space based applications.

* information listed above is at the time of submission.

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