A Multi-Representation Architecture for STEP AP210-based PCB Stackup Design and Warpage Analysis

Award Information
Agency:
Department of Commerce
Branch
National Institute of Standards and Technology
Amount:
$269,592.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
SB1341-06-C-0024
Agency Tracking Number:
104-18
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
InterCAX, LLC
2402 Lively Trail, Atlanta, GA, 30345
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Russell Peak
() -
Business Contact:
Russell Peak
(678) 369-0628
Russell.Peak@InterCAX.com
Research Institution:
n/a
Abstract
This effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a multi-representation approach the PI first conceived at Georgia Tech for CAD-CAE interoperability. This method defines and combines key ingredients in a novel way: rich product models based on open standards, idealization capture, advanced analytical modeling and finite element meshing, and a modular architecture based on knowledge patterns. Phase 2 accelerates this work towards commercialization by exploring effective meshing and idealization refinements, completing validation vs. physical measurements, and benchmarking performance with challenge problems: dual-sided PCAs with 20+ complex devices. COMMERCIAL APPLICATIONS: Evaluating and correcting PCA/B warpage during design offers major improvements in electronics manufacturing yield and reliability. Integrating warpage analysis tools with established ECAD and MCAE tools benefits product development speed and efficiency. Our new warpage tools will provide significant advantages to U.S. manufacturers (PCB fabricators, package assembly and test houses, and contract manufacturers), potentially saving $100M/year. This effort will provide highly automated warpage simulation tools initially aimed at PCBs, PCAs, and chip packages. We will offer these innovative capabilities both as rich applications and as turnkey engineering web services for small or low frequency users. The new comprehensive warpage solution could also become part of larger product lifecycle management (PLM) systems for electronics OEMs and their subcontractors.

* information listed above is at the time of submission.

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