DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$500,000.00
Award Year:
1987
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Agency Tracking Number:
4531
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
International Micro Industries
23 Olney Ave, Cherry Hill, NJ, 08003
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Thomas L Angelucci Sr
() -
Business Contact:
() -
Research Institution:
n/a
Abstract
THIS EFFORT WILL FOCUS ON LOWERING COST AND IMPROVING PER- FORMANCE BY ELIMINATING CERAMIC AND PLASTIC PACKAGES PRES- USED IN SURFACE MOUNTING SEMICONDUCTOR CHIPS. THE CHIP WILL BE MOUNTED DIRECTLY TO A PREPARED FOOTPRINT ON THE PRINTED CIRCUIT BOARD (PCB) UTILIZING ADVANCED TAPE AUTO- MATED BONDING (TAB) AND NEW CHIP OVERCOATING MATERIALS. A COMMERCIALLY AVAILBLE VLSI SHIP WITH MORE THAN 60 I/O'S WILL BE SELECTED (THE PRIME CANDIDATE IS A CHIP WITH 136 I/O'S) TO BE TAB SURFACE MOUNTED TO PCB'S AND THEN OVER- COATED WITH SPECIALIZED ENCAPSULANTS. PRIOR TO EXCISE AND SURFACE MOUNTING, THE CHIP WILL BE PROCESSED WITH ELEC- TROPLATED GOLD BUMPS ON EACH CHIP BONDING PAD, THEN INNER LEAD BONDED (ILB) TO A 35MM FILM OF POLYIMIDE MATERIAL TO WHICH COPPER FOIL HAS BEEN LAMINATED, AND THE APPROPRIATE CIRCUIT PATTERN ETCHED AND GOLD PLATED. THE ILB PROCESS IS ACCOMPLISHED WITH GANG BONDING, A SINGLE OPERATION THAT BONDS ALL OF THE CIRCUIT LEADS TO THEIR ASSIGNED BONDING PADS. THE SURFACE MOUNTED AND OVERCOATED CIHIP- ON-BOARD WILL BE TESTED AND EVALUATED FOR ENVIRONMENTAL AND

* information listed above is at the time of submission.

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