ADVANCED SILICON-ON-SILICON MULTICHIP MODULE DEVELOPMENT FOR AUTOMATED PRODUCTION.

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$49,942.00
Award Year:
1991
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
15204
Agency Tracking Number:
15204
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
8000 A Commerce Parkway, Mt Laural, NJ, 08054
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Philip Rima
Principal Investigator
(609) 273-0200
Business Contact:
() -
Research Institute:
n/a
Abstract
IMI PROPOSES TO UTILIZE ITS RECENT SUCCESSFUL PACKAGING RESEARCH IN MULTICHIP SILICON-ON-SILICON ASSEMBLIES TO DEVELOPA HIGH DENSITY, HIGH PERFORMANCE DESIGN FOR LOW COAST DIGITAL AND ANALOG MODULES. A CIRCUITED SILICON WAFER WILL BE UTILIZED AS A SUBSTRATEON WHICH TO MOUNT FOUR OR MORE SILICON DEVICES. TAPE AUTOMATED BONDING (TAB) WILL BE UTILIZED AS THE INTERCONNECTION TECHNOLOGY BECAUSE OFITS SUPERIOR THERMAL AND PERFORMANCE CHARACTERISTICS, AS WELL AS ITS ABILITY TO ACCOMMODATE 4 MIL PITCH BONDS, BOTH INNER AND OUTER LEAD. THE SILICON WAFER WILL HAVE 2 MIL2 GOLD BUMPS ELECTROPLATED ON THE PADS OF THE OLB FOOTPRINT. EACH CHIP WILL BE EXCISED FROM ITS TAB PATTERN AND MOUNTED TOP SIDE DOWN (FLIP TAB), WITH A SPACER MOUNTED ON THE TOP SURFACE TO: A) MAINTAIN THE POSITION OF TAB LEADS ON 4 MIL PITCH WHEN THEY ARE EXCISED, AND B) PROVIDE THE NECESSARY SPACING OF THE TAB LEADS ABOVE THE HEIGHT OF THE BUMPS TO ALLOW PATTERN RECOGNITION AND THE PRECISE POSITIONING REQUIRED FOR OUTER LEAD BONDING. ALONG WITH THEPERFORMANCE/COST TRADEOFFS, AUTOMATION FOR PRODUCTION PROCESSES WILL BE DEFINED IN PHASE I, AND DEVELOPED IN PHASE II. ANITCIPATED BENEFITS/POTENTIAL COMMERCIAL APPLICATIONS - SUCCESSFUL COMPLETION OF THIS PROJECT WILL PROVIDE ECONOMICAL OPTIONS FOR PACKAGING ENGINEERS INVOLVED IN LEADING EDGE HIGH DENSITY, HIGH PERFORMANCE REQUIREMENTS, BOTH DIGITAL AND ANALOG. AUTOMATION OF TAB INTERCONNECTED MULTICHIP SILICON-ON-SILICON MODULES WILL RESULT IN HIGH RELIABILITY AND ATTRACTIVE PRODUCTION YIELDS, ALONG WITH CIRCUIT PERFORMANCE NOT POSSIBLE WITH WIRE BONDING.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government