High Temperature Silicon Carbide (SiC) Gate Driver

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-11-C-0038
Agency Tracking Number: A102-132-1177
Amount: $119,899.00
Phase: Phase I
Program: SBIR
Awards Year: 2010
Solicitation Year: 2010
Solicitation Topic Code: A10-132
Solicitation Number: 2010.2
Small Business Information
535 W. Research Center Blvd., Suite 209, Fayetteville, AR, 72701
DUNS: 121539790
HUBZone Owned: Y
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Roberto Marcelo Schupbach
 Chief Technology Officer
 (479) 443-5759
Business Contact
 Sharmila Mounce
Title: Business Operations Manag
Phone: (479) 443-5759
Email: smounce@apei.net
Research Institution
The objective of this proposal is to develop and commercialize a high temperature gate driver for silicon carbide (SiC) FET switches to enable the development of the next generation of high-efficiency, high-power-density power converters. At the conclusion of Phase I, Arkansas Power Electronics International, Inc. (APEI, Inc.) will design and fabricate a high temperature (250 °C) gate driver utilizing discrete SiC circuitry and high temperature silicon-on-insulator (HTSOI) ASICs with off chip planar magnetic isolation. These designs will then be transitioned into an all SiC IC process in Phase II. APEI, Inc. has already developed a discrete HTSOI/SiC based gate driver which will meet most of the electrical needs of this program. This Phase I will focus on enhancing the features of APEI, Inc.’s gate driver technology, and provide a development path for implementing the technology in an all SiC IC. APEI, Inc. will commercialize the full gate driver (ICs, transformers, packaging, etc.) into military platforms through our prime defense partners at the conclusion of Phase II.

* Information listed above is at the time of submission. *

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