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Advanced Packaging Concept for High Temperature Silicon Carbide Power Modules (kTC P214)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-04-C-0702
Agency Tracking Number: A022-1058
Amount: $729,386.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A02-232
Solicitation Number: 2002.2
Timeline
Solicitation Year: 2002
Award Year: 2005
Award Start Date (Proposal Award Date): 2004-12-15
Award End Date (Contract End Date): 2006-12-15
Small Business Information
110 Gibraltar Road Suite 223
Horsham, PA 19044
United States
DUNS: 967049065
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mark Montesano
 VP Engineering
 (631) 285-6580
 monte@k-technology.com
Business Contact
 Adam Rosen
Title: VP CFO
Phone: (215) 957-7858
Email: a.rosen@k-technology.com
Research Institution
N/A
Abstract

k Technology Corporation (kTC) proposes to develop an Integrated Thermal Module (ITM) to be an integral part of a high performance power electronics package using silicon carbide (SIC) devices. The module will optimize the heat transfer from the active silicon carbide to the cooling fluid. By minimizing the temperature rise through the package, the coolant temperature can be maximized, and therefore the heat exchanger can be made smaller. The proposed package material has high conductivity, low coefficient of thermal expansion, and low mass density. The high conductivity and low CTE will minimize the thermal impedance through the power electronics package. To demonstrate the effectiveness of the Integrated Thermal Module under realistic loads it will be integrated into a converter. The converter will be tested with a permanent magnet motor and passive inductive loads.

* Information listed above is at the time of submission. *

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