Novel Multifunctional Lightweight Nanocomposites
Small Business Information
Aspen Systems, Inc.
184 Cedar Hill Street, Marlborough, MA, 01752
Somesh k Mukherjee
President & CEO
President & CEO
AbstractNanocomposites, the integration of nanomaterials into metals, polymers and ceramics, are an area of intense interest to the Army for the design of next generation lightweight structures with enhanced properties and multifunctional capabilities. Aspen Systems Inc. proposes to develop a new class of lightweight, ultrahigh strength and ductile nanograin aluminum alloy-CNT hybrid composite with radio frequency electromagnetic interference (RF/EMI) shielding in bulk form suitable for Army’s future lightweight, multifunctional structural material design program. The hybrid composite will be suitably designed to include amorphous/nanophase matrix with coherent nanophase dispersion particles embedded in the matrix and carbon nanotubes (CNT) reinforcement in order to attain the high strength, desired ductility and added functionality such as RF/EMI shielding. In Phase I, Aspen systems will utilize a special gas atomization technique to produce a grain size of 20- 45 nm range of the selected alloy systems followed by a novel low temperature consolidation technique to produce amorphous/nanograin based composite material structure consisting of nanophase/amorphous Al matrix with suitably chosen coherent dispersion particles and CNT reinforcement. Suitable optimization of the process parameters for nanophase powder production and rapid consolidation will be identified and extensive mechanical testing and analysis will be conducted to establish structure-property relationship of the material. During Phase II program, we will scale-up this process to develop and demonstrate this successful cost effective technology for mass production with proven optimized process parameters based on Phase I data to produce a prototype large nano-Al alloy-CNT composite sheet and billet with superior properties
* information listed above is at the time of submission.