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Chip-scale Waveform Modulation System for Navigation Doppler Lidar

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC21C0525
Agency Tracking Number: 206620
Amount: $749,755.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: Z7
Solicitation Number: SBIR_20_P2
Solicitation Year: 2020
Award Year: 2021
Award Start Date (Proposal Award Date): 2021-07-19
Award End Date (Contract End Date): 2023-07-18
Small Business Information
1100 Exploration Way
Hampton, VA 23666-6264
United States
DUNS: 081170426
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Diego Pierrottet
 (757) 927-5556
Business Contact
 Robin Loeffler
Title: rloeffler
Phone: (757) 325-6835
Research Institution

The NDL is used during terminal descent; this is the phase of EDL in which terrain-relative decisions and final preparations for landing are made. During terminal descent, lander maneuvers include vehicle reorientation to facilitate surface relative sensing and using propulsion to divert away from hazards. During EDL, precise knowledge of the spacecraft state, as well as the properties of the landing area, are critically important.
The NDL directly measures radial velocity and line of sight distance, providing precise knowledge of the vehicle state estimates relative to the landing surface. The unprecedented velocity accuracy provided by the NDL is due to the continuous wave (CW) lidar waveform. As such, the only way to obtain distance measurements is to modulate the waveform. The Linear frequency modulation continuous wave (FMCW) waveform employed provides distance measurements without compromising the accuracy of the velocity measurements.
We propose an innovative integrated opto-electronic device hybridized into a new chip-scale waveform modulation system for Navigation Doppler Lidar. The innovation decreases sensor size, mass, power and cost while maintaining the operational performance needs of the GNamp;C system for precision navigation. Once developed, the complete integrated package of the proposed innovation will provide higher fidelity waveforms, added robustness during operational environments, in miniaturized package.

* Information listed above is at the time of submission. *

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