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Entangled Photon Pair SourceBased On Thin-Film Lithium-Niobate-On-InsulatorPhotonic Integrated Circuits
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Herein, PSI propose a system-on-chip (SoC) solution for an entangled photon pair source (EPPS) based on thin-film lithium niobate on insulator (TFLNOI) photonic integrated circuits (PIC). Using integrated photonic devices such as fiber coupler, waveguide, modulator, splitter/combiner and micro-ring, the proposed EPPS can generate and process the entangled photons with high efficiency and speed. In phase I effort, we will study and model the proposed EPPS at the system level and layout specs for key components and systems. We will develop the periodic poling process for the target TFLNOI platform. And we will design and experimentally demonstrate high-efficiency spontaneous parametric down conversion (SPDC) photon pair generation at telecommunication wavelength toward the end of the phase I work. In addition, a variety of PIC components such as waveguide, splitter/coupler, switch, modulator and filter will also be investigated theoretically and/or experimentally leveraging other ongoing government funded projects. The end result of the phase I work includes a demonstrated SPDC structure on a TFLNOI substrate, a system model and a system PIC design leveraging PSI existing PIC components, which will pave the path toward a full SoC prototype in phase II. Based on our pioneer work in TFLNOI PICs development and with our successful experiences in commercialization of SBIR research efforts, PSI is poised to develop, package, qualify and commercialize the proposed EPPS chip for tomorrowrsquo;s quantum communication demands.
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