Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions

Award Information
Agency:
Department of Defense
Amount:
$99,992.00
Program:
SBIR
Contract:
W9113M-08-C-0050
Solitcitation Year:
2007
Solicitation Number:
2007.3
Branch:
Missile Defense Agency
Award Year:
2008
Phase:
Phase I
Agency Tracking Number:
B073-034-0533
Solicitation Topic Code:
MDA07-034
Small Business Information
KYMA TECHNOLOGIES, INC.
8829 Midway West Road, Raleigh, NC, 27617
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
020080607
Principal Investigator
 Drew Hanser
 CTO & VP Business Development
 (919) 789-8880
 hanser@kymatech.com
Business Contact
 Keith Evans
Title: CEO & President
Phone: (919) 789-8880
Email: evans@kymatech.com
Research Institution
N/A
Abstract
In this Phase I proposal, Kyma Technologies will perform a proof of concept demonstration of high quality bulk GaN/diamond integration for advanced thermal management of high power density GaN-based device applications. The development effort will include separation of thin GaN layers from bulk substrates and bonding to diamond.

* information listed above is at the time of submission.

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