Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0050
Agency Tracking Number: B073-034-0533
Amount: $99,992.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: MDA07-034
Solicitation Number: 2007.3
Small Business Information
8829 Midway West Road, Raleigh, NC, 27617
DUNS: 020080607
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Drew Hanser
 CTO & VP Business Development
 (919) 789-8880
Business Contact
 Keith Evans
Title: CEO & President
Phone: (919) 789-8880
Research Institution
In this Phase I proposal, Kyma Technologies will perform a proof of concept demonstration of high quality bulk GaN/diamond integration for advanced thermal management of high power density GaN-based device applications. The development effort will include separation of thin GaN layers from bulk substrates and bonding to diamond.

* Information listed above is at the time of submission. *

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