LASERLITH CORP.

Address

4775 Technology Circle, Suite 3
Grand Forks, ND, 58203-5635

Information

DUNS: 618971964
# of Employees: 11

Ownership Information

Hubzone Owned: N
Socially and Economically Disadvantaged: N
Woman Owned: N

Award Charts




Award Listing

  1. STTR Phase II: Micromachined components for wireless applications

    Amount: $734,890.00

    The broader impact/commercialization potential of this project include tunable blocks that would allow a range of spectrally- and spatially-agile devices. These may include high-gain directional anten ...

    STTRPhase II2014National Science Foundation
  2. STTR Phase I: Micromachined Varactor for Antenna Impedance Matching

    Amount: $149,497.00

    This Small Business Technology Transfer (STTR) Phase I project will develop micromachined antenna tuning module products for cell phone and portable computing applications. The proposed technology can ...

    STTRPhase I2012National Science Foundation
  3. SBIR Phase I: RF MEMS Relay for ATE Applications

    Amount: $149,924.00

    This Small Business Innovation Research (SBIR) Phase I project will develop RF MEMS (Radio Frequency Microelectromechanical Systems) relays for automated test equipment (ATE), wireless frontends, and ...

    SBIRPhase I2012National Science Foundation
  4. Development of Nanothermite-Based Microthrusters

    Amount: $729,951.00

    Low Cost Course Correction Technology (LCCCT) can improve the accuracy and dispersion of gun launched projectiles, mortars and rockets. Based on microthrusters that provide altitude control and pointi ...

    SBIRPhase II2009Army Department of Defense
  5. Development of Nanothermite-Based Microthrusters

    Amount: $119,945.00

    Low Cost Course Correction Technology (LCCCT) can improve the accuracy and dispersion of gun launched projectiles, mortars and rockets. Based on microthrusters that provide altitude control and point ...

    SBIRPhase I2008Army Department of Defense
  6. Microelectromechanical Systems Packaging

    Amount: $119,992.00

    Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undes ...

    SBIRPhase I2006Army Department of Defense

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