Microelectromechanical Systems Packaging

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$119,992.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-06-C-0160
Award Id:
78558
Agency Tracking Number:
A052-147-2000
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
120 East Union Avenue, Bound Brook, NJ, 08805
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
618971964
Principal Investigator:
ZhixiongXiao
Optical Engineer
(732) 648-8039
LaserlithCo@aol.com
Business Contact:
MaisyFong
President
(732) 648-8039
LaserlithCo@aol.com
Research Institute:
n/a
Abstract
Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.

* information listed above is at the time of submission.

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