Microelectromechanical Systems Packaging
Department of Defense
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Small Business Information
120 East Union Avenue, Bound Brook, NJ, 08805
Socially and Economically Disadvantaged:
AbstractMany standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.
* information listed above is at the time of submission.