Microelectromechanical Systems Packaging

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-06-C-0160
Agency Tracking Number: A052-147-2000
Amount: $119,992.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solitcitation Year: 2005
Solitcitation Topic Code: A05-147
Solitcitation Number: 2005.2
Small Business Information
120 East Union Avenue, Bound Brook, NJ, 08805
Duns: 618971964
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Zhixiong Xiao
 Optical Engineer
 (732) 648-8039
Business Contact
 Maisy Fong
Title: President
Phone: (732) 648-8039
Email: LaserlithCo@aol.com
Research Institution
Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.

* information listed above is at the time of submission.

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