MICROMACHINING GAAS WAFERS

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$255,000.00
Award Year:
1987
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Award Id:
4079
Agency Tracking Number:
4079
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1175 Kottinger Dr, Pleasanton, CA, 94566
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
J W Pearson
(415) 846-4027
Business Contact:
() -
Research Institution:
n/a
Abstract
MICROMACHINING GAAS WAFERS HOLD PROMISE OF FLATTER WAFERS, WITH BETTER PARALLELISM (UNIFORMITY OF THICKNESS), WHICH IN TURN PROMISES BETTER YIELD AND CIRCUITRY REPEATABILITY. MOREOVER, THE SAME PROCESS CAN BE USED TO PROVIDE BETTER CONTROL OF POST-CIRCUITRY THINNING. EXPERIMENTS WILL BE CONDUCTED TO IMPROVE SURFACE FINISH AND REDUCE SUBSURFACE DAMAGE. HANDLING AND CHUCKING TECHNIQUES WILL BE DEVELOPED TO REDUCE HANDLING HAZARDS AFTER THINNING.

* information listed above is at the time of submission.

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