MICROMACHINING GAAS WAFERS

Award Information
Agency:
Department of Defense
Amount:
$255,000.00
Program:
SBIR
Contract:
N/A
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Air Force
Award Year:
1987
Phase:
Phase II
Agency Tracking Number:
4079
Solicitation Topic Code:
N/A
Small Business Information
Lehrer-pearson Inc.
1175 Kottinger Dr, Pleasanton, CA, 94566
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
N/A
Principal Investigator
 J W Pearson
 (415) 846-4027
Business Contact
Phone: () -
Research Institution
N/A
Abstract
MICROMACHINING GAAS WAFERS HOLD PROMISE OF FLATTER WAFERS, WITH BETTER PARALLELISM (UNIFORMITY OF THICKNESS), WHICH IN TURN PROMISES BETTER YIELD AND CIRCUITRY REPEATABILITY. MOREOVER, THE SAME PROCESS CAN BE USED TO PROVIDE BETTER CONTROL OF POST-CIRCUITRY THINNING. EXPERIMENTS WILL BE CONDUCTED TO IMPROVE SURFACE FINISH AND REDUCE SUBSURFACE DAMAGE. HANDLING AND CHUCKING TECHNIQUES WILL BE DEVELOPED TO REDUCE HANDLING HAZARDS AFTER THINNING.

* information listed above is at the time of submission.

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