MICROMACHINING GAAS WAFERS

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 4079
Amount: $255,000.00
Phase: Phase II
Program: SBIR
Awards Year: 1987
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
1175 Kottinger Dr, Pleasanton, CA, 94566
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 J W Pearson
 (415) 846-4027
Business Contact
Phone: () -
Research Institution
N/A
Abstract
MICROMACHINING GAAS WAFERS HOLD PROMISE OF FLATTER WAFERS, WITH BETTER PARALLELISM (UNIFORMITY OF THICKNESS), WHICH IN TURN PROMISES BETTER YIELD AND CIRCUITRY REPEATABILITY. MOREOVER, THE SAME PROCESS CAN BE USED TO PROVIDE BETTER CONTROL OF POST-CIRCUITRY THINNING. EXPERIMENTS WILL BE CONDUCTED TO IMPROVE SURFACE FINISH AND REDUCE SUBSURFACE DAMAGE. HANDLING AND CHUCKING TECHNIQUES WILL BE DEVELOPED TO REDUCE HANDLING HAZARDS AFTER THINNING.

* Information listed above is at the time of submission. *

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