SBIR Phase I: Shear Stress Sensor Based on Optical Micro-Spring Technology

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0839528
Agency Tracking Number: 0839528
Amount: $99,981.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: N/A
Solicitation Topic Code: EL
Solicitation Number: NSF 08-548
Small Business Information
Lenterra Inc
7 Tenney Road, West Orange, NJ, 07052
DUNS: 139119759
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Vadim Stepaniuk
 PhD
 (973) 623-0755
 vadim@lenterra.com
Business Contact
 Vadim Stepaniuk
Title: PhD
Phone: (973) 623-0755
Email: vadim@lenterra.com
Research Institution
N/A
Abstract
This Small Business Innovation Research Phase I project is aimed at the development of a wall shear stress sensor with an Optical Micro-Spring (OMS) as its core element. The OMS, a miniature fiber-based load cell, relies on the morphology-dependent optical resonances known as Whispering Gallery Modes (WGM) realized in a microcavity. A miniature and robust sensor is proposed that is capable of direct measurement of wall shear stress in either transparent or opaque media. Due to high quality factor of WGM technology, displacements of the sensing element as small as a hundredth of a nanometer can be detected. The sensor therefore virtually does not have any moving parts while detecting sensing element displacements within more than four orders of magnitude of the shear force. The project will advance the understanding of the fundamental processes occurring in the boundary layer of a flow. For non-Newtonian or otherwise rheologically complex fluids the wall shear stress can not be easily calculated or, especially for non-transparent flows, measured. The chemical and pharmaceutical industries suffer from an inability to scale and predict mixing equipment performance. Direct measurements of wall shear stress would significantly improve existing CFD models and provide a means to increase process control, quality and throughput for high intensity mixing devices and to reduce the cost of the final product.

* information listed above is at the time of submission.

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