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Energy & Power Dense Supercapacitor: On-Chip Integration in MEMs Fabrication

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: HQ072721P0030
Agency Tracking Number: E21A-001-0030
Amount: $167,372.41
Phase: Phase I
Program: STTR
Solicitation Topic Code: DMEA21A-001
Solicitation Number: 21.A
Timeline
Solicitation Year: 2021
Award Year: 2021
Award Start Date (Proposal Award Date): 2021-08-05
Award End Date (Contract End Date): 2022-02-09
Small Business Information
200 Yellow Place Pines Industrial Center
Rockledge, FL 32955-1111
United States
DUNS: 175302579
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Justin Hill
 (321) 631-3550
 jhill@mainstream-engr.com
Business Contact
 Michael Rizzo
Phone: (321) 631-3550
Email: contracting@mainstream-engr.com
Research Institution
 University of Florida
 Kevin Jones
 
Gainesville
Gainesville, FL 32611-5500
United States

 (352) 392-3516
 Nonprofit College or University
Abstract

Due to recent advances in the field of microelectronics, there is an increasing demand for micro-sized energy storage devices that are capable of being incorporated into and provide energy for MEMS devices. In order to continue to enable this technological growth, and the benefits that stem from it, the storage density of electrical energy must also continually be improved, especially with respect to “on-chip” storage for micro-sensors, pumps, valves, switches, and others. Supercapacitors are energy storage devices that are capable of maintaining the high-power density achievable with electrostatic capacitors while having higher energy density. They therefore have fast frequency response times but are capable of providing power for longer periods of time. Though their energy density is still much lower than that of a battery, their cycle life is far greater.Our supercapacitor electrode technology can provide state-of-the-art performance due to our novel and highly versatile fabrication method. We’ve previously shown several methods to fabricate micro-supercapacitors in a variety of on-chip configurations. The following proposal highlights our novel ultra-high surface area electrodes manufactured from a highly scalable and low-cost process. We currently project their performance metrics to be 7x and 2x higher in energy and power density, respectively.

* Information listed above is at the time of submission. *

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