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Parallel Optical Memory Interconnects
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In this proposal, we describe a novel approach for realizing a parallel, nonmechical, read/write interconnection for angle-multiplexed three-dimensional (3-D) optical memories. Our concept represents a significant first step required toward taking this critical memory technology from the laboratory and inserting it into operational systems. The concept utilizes novel optomechanical packaging and electro-optical switching components to combine functions and dramatically reduce package size. While development of 3-D optical memories has progressed dramatically with regard to storage materials and capacity, the optical interfaces have remained largely unaddressed. As a result, typical 3-D optical memories described in the open literature occupy the better part of a laboratory optical bench. Such configurations do not lend themselves to near-term deployment. In this proposal we descirbe the means to implement and compactly package an optical interconnection system for use in fieldable 3-D optical mass-memory systems.
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