Rapid, low-cost composite manufacturing processes

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$69,819.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
DASG60-02-P-0032
Award Id:
59029
Agency Tracking Number:
02-0527
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
921 Main St, Monroe, CT, 06468
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
929950012
Principal Investigator:
Prashant Karandikar
Program Manager
(302) 454-8600
karandikar@mmmtech.com
Business Contact:
Michael Aghajanian
Director of Product Devl.
(302) 454-8600
aghajanian@mmmtech.com
Research Institute:
n/a
Abstract
"M Cubed has developed three key processes for manufacturing advanced materials components which include PRIMEX, DIMOX and reaction bonding. The processes have been used to make a variety of components for commercial and military systems making themlighter, stiffer, highly functional and resistant to many threats. However, market penetration has been achieved only in high value added commercial products making the products expensive for military applications as well. M Cubed proposes a revolutionarymodification to these manufacturing processes to make the products made by these technologies commercially viable and thus cost effective for military applications. In Phase I the feasibility of these modifications will be demonstrated. In Phase II, theseprocesses will be further optimized and used for manufacturing prototype components for ballistic applications. The Phase I program will prove the feasibility of a revolutionary modification to the above processes. At the end of Phase II, scaled-upmanufacturing processes will be available for the production of various commercial and military components. When commercialized the technology will produce affordable, strong, stiff, lightweight components in many application areas such as armor, thermalmanagement (military and commercial avionics), tank and automotive components, missiles etc."

* information listed above is at the time of submission.

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