Transient Demonstration of a Pulse-Power Electronic Cooling
Small Business Information
Mainstream Engineering Corp.
200 Yellow Pl., Rockledge, FL, 32955
Robert P. Scaringe
AbstractThis research will develop an innovative and effective technique for the removal of heat from high heat flux electronic components. The cooling fluid is passed through micro-channels engraved in chip substrate which acts as an evaporator in a heat pump loop. The flow in micro-channels is controlled automatically by a TXV to provide subcooled nucleate boiling with no dry out in the channels. This results in a very large heat transfer coefficient and consequently low and isothermal temperature for the electronic components. Fundamental heat transfer measurements for both steady-state and transient two-phase flow in micro-channels will be performed for different combinations of operating pressure, passage size and configuration, fluid flow rate, and fluid properties. The effort will experimentally demonstrate that the proposed pulsed-power electronic cooling system has significant benefits in terms of reduced weight, increased reliability, rapid response, increased heat flux in excess of 2x10(6) W/m(2)),and increased operational flexibility when compared to alternative rapid-transient electronic cooling designs.
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