Transient Demonstration of a Pulse-Power Electronic Cooling

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$49,443.00
Award Year:
1992
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
18162
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Mainstream Engineering Corp.
200 Yellow Pl., Rockledge, FL, 32955
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Robert P. Scaringe
(407) 631-3550
Business Contact:
() -
Research Institution:
n/a
Abstract
This research will develop an innovative and effective technique for the removal of heat from high heat flux electronic components. The cooling fluid is passed through micro-channels engraved in chip substrate which acts as an evaporator in a heat pump loop. The flow in micro-channels is controlled automatically by a TXV to provide subcooled nucleate boiling with no dry out in the channels. This results in a very large heat transfer coefficient and consequently low and isothermal temperature for the electronic components. Fundamental heat transfer measurements for both steady-state and transient two-phase flow in micro-channels will be performed for different combinations of operating pressure, passage size and configuration, fluid flow rate, and fluid properties. The effort will experimentally demonstrate that the proposed pulsed-power electronic cooling system has significant benefits in terms of reduced weight, increased reliability, rapid response, increased heat flux in excess of 2x10(6) W/m(2)),and increased operational flexibility when compared to alternative rapid-transient electronic cooling designs.

* information listed above is at the time of submission.

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