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Performance Improvements of Spray Cooled GaN Microwave Amplifiers

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG6002P0086
Agency Tracking Number: 02-0857
Amount: $69,998.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2003
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
200 Yellow Place, Pines Industrial Center
Rockledge, FL 32955
United States
DUNS: 175302579
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Gregory Cole
 Sr. Mechanical Engineer
 (321) 631-3550
 gsc@mainstream-engr.com
Business Contact
 Kathy McGraw-Davids
Title: Comptroller
Phone: (321) 631-3550
Email: mkd@mainstream-engr.com
Research Institution
N/A
Abstract

Mainstream Engineering Corporation has already demonstrated the value of integrating a saturated liquid spray cooling system with high power GaAs microwave amplifiers in phased array transmitters. Optimized cooling systems can increase reliability by anorder of magnitude, improve efficiency by 30%, and increase power by 30%. Mainstream will now demonstrate similar performance enhancements of GaN amplifiers being developed for x-band active aperture arrays. In Phase I a detailed thermal model will beexperimentally derived, performance tests on actual GaN chips will be conducted, and demonstration of a breadboard system will be completed. A Phase II Fast Track is planned and will be used to demonstrate and life test a complete wide bandgap amplifierpackage and thermal management system. There is an urgent need to develop advanced cooling methods that can be implemented into the thermal packaging of the next generation of military, aerospace, and commercial electronics. Mainstream has alreadydemonstrated saturated liquid spray cooling systems that are possible and practical. Commercial applications include satellites and super-computer chip modules.

* Information listed above is at the time of submission. *

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