Nano-Structure Enhanced Microfluidics Device for Spot Cooling

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$119,905.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
W56HZV-08-C-0083
Agency Tracking Number:
A072-212-2711
Solicitation Year:
2007
Solicitation Topic Code:
A07-212
Solicitation Number:
2007.2
Small Business Information
MAINSTREAM ENGINEERING CORP.
200 Yellow Place, Pines Industrial Center, Rockledge, FL, 32955
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
175302579
Principal Investigator:
Greg Cole
PI/Engineering Director
(321) 631-3550
gsc@mainstream-engr.com
Business Contact:
Michael Rizzo
Controller
(321) 631-3550
mar@mainstream-engr.com
Research Institution:
n/a
Abstract
The Army is currently seeking advanced thermal management technologies for cooling localized hot spots in military vehicular power electronics. Electrowetting microfluidic devices provide highly-efficient discrete cooling with nano-liter volumes of fluid. The microdroplet is typically sandwiched between two hydrophobic coated electrodes. A control voltage is applied successively across multiple control electrodes, manipulating the interfacial forces, and transporting the fluid. State-of-the-art systems require large voltages (30-40 V) to initiate movement. A nano-structure enhanced microfluidics device is proposed that will reduce this large threshold voltage and increase heat transfer rates. In Phase I, Mainstream will fabricate and demonstrate the improved microfluidics device. Test results will be compared to other microfluidics devices found in the literature. A specific Army vehicle, power electronics system, and microelectronics device will be selected for analysis. In Phase II, Mainstream will fabricate an integrated microelectronics/microfluidics device and complete extensive testing. The technology will be ready for transition to the Army at the end of Phase II.

* information listed above is at the time of submission.

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