Experimental Demonstration of an Improved Cryocooler Configuration to Lower the Gimbaled Mass and Volume for Infrared Sensors

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,942.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
HQ0006-08-C-7844
Award Id:
86367
Agency Tracking Number:
B073-004-0263
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
200 Yellow Place, Pines Industrial Center, Rockledge, FL, 32955
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
175302579
Principal Investigator:
Robert Scaringe
PI/Sr. Research Engineer
(321) 631-3550
rps@mainstream-engr.com
Business Contact:
Michael Rizzo
Controller
(321) 631-3550
mar@mainstream-engr.com
Research Institute:
n/a
Abstract
The objective of this effort is to reduce the weight of the cryocooler system, improve the efficiency of the cryocooler system, provide multiple cryocooler temperatures, and improve the configuration of the gimbaled flexible joint. At first glance, this set of claims seems incredibly ambitious; however, as disclosed in this proposal, these achievements can be obtained by implementing an improved cryogenic cooler. The proposed configuration can also provide multiple cooling temperatures, allowing both the cryogenic cooling and the electronics thermal control from a single cooler. This Phase I effort includes the experimental demonstration of this cryocooler (in a bench-top configuration), as well as a demonstration of an improved gimbaled flexible joint. Phase I also includes a comparison with current state-of-the-art technology to verify mass, reliability, and energy benefits. Clearly, Mainstream has the prior experience in this area, and the effort proposed in Phase I, which includes a preliminary design and bench-top demonstration experiments, exceeds the scope of effort proposed in the Phase I solicitation; however, Mainstream is well into this research and excited about the commercial potential for this technology. Phase II will address the fabrication and demonstration of a complete system.

* information listed above is at the time of submission.

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