Nano-Structure Enhanced Microfluidics Device for Spot Cooling
Small Business Information
MAINSTREAM ENGINEERING CORP.
200 Yellow Place, Pines Industrial Center, Rockledge, FL, 32955
AbstractIn the Phase I effort, Mainstream made significant improvements to the hydrophobic layer that is incorporated into a digital microfluidics device. A design for a test digital microfluidics device was also completed in the Phase I effort. In the proposed effort, the improved hydrophobic layer will be demonstrated with a test digital microfluidics device to decrease the typically high activation voltage (30-40V) and to increase droplet speed. Next, a full system will be built including heat rejection to the environment will be demonstrated to evaluate the cooling capacity of the digital microfluidics system designed for mobile power inverters. The target heat fluxes for the device are 100 W/cm2 over the entire device and 250 W/cm2 for the local hot spots. At the conclusion of the Phase II effort, Mainstream will work with commercial partners to integrate the successful digital microfluidics device into power conversion electronics for mobile applications.
* information listed above is at the time of submission.