3D Reinforced C/SiC

Physical Sciences Inc. (PSI) proposes to advance the Direct Z-Pin Insertion (DZI) process for local application of 3D reinforcements in high temperature composite structures (2000F-4500F). The DZI process inserts rigid composite pins normal (through thickness) to a 2D polymer composite preform prior to cure. DZI is designed to affordably provide the needed 3D reinforcement yet enable 2D laminate design and fabrication. The pins improve both interlaminar tension and shear strength in the final composite structure. During the Phase II program PSI will optimize DZI process parameters to maximize enhancements to the interlaminar properties of high temperature C-SiC CMC. The DZI process is performed at the polymer composite level making the capability applicable to other material forms such as C-C. In addition to enhancing interlaminar strength, DZI is a valuable process aid for homogenizing the through thickness density of thick laminates by providing pathways for gas exit and polymer reinfiltration. Benefits of applying DZI as a preform stabilization tool to avoid ply wrinkling will also be demonstrated. An economic analysis, identifying DZI automation requirements for greater affordability, will be provided. Interaction with OEMS will define demonstration articles that can be built and tested during a Phase III program. Approved for Public Release | 22-MDA-11102 (22 Mar 22)