FLEXIBLE MANUFACTURING OF MMC ELECTRONIC PACKAGES

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$65,000.00
Award Year:
1994
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
27513
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Materials And Electrochemical
7960 S Kolb Rd, Tucson, AZ, 85706
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
C T Lee
(602) 574-1980
Business Contact:
() -
Research Institution:
n/a
Abstract
METAL MATRIX COMPOSITES (MMC), WITH THEIR HIGH THERMAL CONDUCTIVITY, LIGHT WEIGHT, EMI SHIELDING, AND TAILORABLE COEFFICIENT OF THERMAL EXPANSION (CTE) ARE THE EMERGING MATERIALS OF CHOICE FOR HEAT SINK, CONSTRAINING CORE, AND PACKAGING APPLICATIONS. AFFORDABLE AND TIMELY MANUFACTURING METHODS ARE DESIRED FOR SMALL LOTS OF ELECTRONIC PACKAGING APPLICATIONS SUCH AS MICROWAVE T/R MODULE AND MULTICHIP MODULES (MCMS). IN THIS PROJECT, THE COMPOSITE PROCESSING CAPABILITY AND THE TOOLING FABRICATION CAPABILITY ARE BEING COMBINED TO DEVELOP A FLEXIBLE MANUFACTURING METHOD FOR SMALL PRODUCTION RUNS OF HIGH PERFORMANCE MMC ELECTRONIC PACKAGES. A PROTOTYPE MMC MCMS IS BEING DEIGNED TO TEST THE FEASIBILITY OF USING SOLID FREEFORM FABRICATION (SFF) MODELS TO GENERATE TOOLING FOR RAPID PROTOTYPING OF MMC PACKAGES. NEAR-NET-SHAPE MANUFACTURING OF THE COMPOSITE PACKAGES IS BEING DEMONSTRATED. PROPERTIES OF MMC PACKAGES SUCH AS CTE, THERMAL CONDUCTIVITY, MODULUS, DENSITY, SURFACE FINISH, AND DIMENSIONAL TOLERANCE ARE BEING CHARACTERIZED.

* information listed above is at the time of submission.

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