Low Cost Al/Diamond Composites for Thermal Management Applications
Small Business Information
Materials & Electrochemical Research Cor
7960 S. Kolb Road, Tucson, AZ, 85706
Dr. Sion Pickard
AbstractIn Phase I, MER has demonstrated low cost diamond/Al and diamond/Mg composites, which have the highest thermal conductivity of any known isotropic composite available today (>640 W/m/K), with low CTE (<7.5 p.p.m/K) for compatibility with GaAs and Si devices in electronics applications. The Phase II effort is focused on confirming low cost fabrication and processing of diamond/Al composites into useful forms including rolling of thin sheet (0.05 thick) and sheet joining for space radiators and building power electronic devices, using vapor deposition techniques for adherent dielectric layers with laser micro-machining and metallization techniques for 3-D devices.
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