Thermal Management Techniques for Bonded Electronic Components

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00178-02-C-3056
Agency Tracking Number: N02-099-08
Amount: $69,960.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
7960 S. Kolb Rd., Tucson, AZ, 85706
DUNS: 147518286
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Sion Pickard
 Senior Scientist
 (520) 574-1980
Business Contact
 J.C. Withers
Title: CEO
Phone: (520) 574-1980
Research Institution
"This SBIR Phase I seeks to develop a family of unique highly thermally conductive diamond/epoxy composite adhesives for die attach of power electronic devices. Diamond has a conductivity of above 1800 W/m.K as compared to the conventional epoxy matrixwith a conductivity of 0.2 W/m.K. Hence the incorporation of the diamond filler particles with volume loading, Vf>50% can greatly increase the conductivity of the epoxy matrix to levels above 20-50 W/m.K, whilst retaining high bond strength and ease ofapplication. The most key innovation is to tailor the interface of the diamond particulate filler to allow acoustic coupling with the epoxy matrix for high conductivity by use of coating of the diamond with intermediate acoustic impedance layers with useof self-assembly coupling agents. High conductivity adhesives are essential for heat management in modern power electronic devices. The proposed innovation of using diamond filler will make thermal adhesives specifically for commercial high heat fluxapplications."

* Information listed above is at the time of submission. *

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