Thermal Management

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$69,987.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
N00178-02-C-1033
Agency Tracking Number:
N02-045-16
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Materials & Electrochemical Research (Mer) Corp.
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
147518286
Principal Investigator
 Chris Chen
 Principal Investigator
 (520) 574-1980
 mercrop@mercorp.com
Business Contact
 J.C. Withers
Title: Chief Executive Officer
Phone: (520) 574-1980
Email: jcwithers@mercorp.com
Research Institution
N/A
Abstract
"With both the increasing density of semiconductor devices and the increasing power from these devices, substrates having high thermal conductivity will be needed. This program proposes an innovative materials that has thermal conductivity higher than 500W/m¿K, CTE matches to Si or GaAs, and remains cost effective. A common problem in the design of microelectronic packages, however, is that material candidates having high thermal conductivity also have a high CTE. The uniqueness of this compositematerial is that the carrier substrates can be tailored to match the thermal expansion characteristics of the chip or other heat-generating components attached to the carrier substrate which also providing improved heat transfer. The innovative materialin this program is a technology that enables electronics to acheive higher speeds, smaller size and higher reliability. High thermal conductivity heat sink materials are primarily found in fiber optic components in internet related applications whichinclude amplifiers, receivers, transmitters, tunable lasers, modulators. Other areas of application include RF power package components that are used in wireless telecommunication infrastructure for cellular phones, base stations, high definitiontelevision (HDTV), and satellite communications."

* information listed above is at the time of submission.

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