Materials Based Solution for ImprovedThermal Management

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$70,000.00
Award Year:
2003
Program:
STTR
Phase:
Phase I
Contract:
N00014-03-M-0317
Award Id:
65209
Agency Tracking Number:
N033-0222
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
147518286
Principal Investigator:
SionPickard
Principal Investigator
(520) 574-1980
mercorp@mercorp.com
Business Contact:
J.C.Withers
CEO
(520) 574-1980
jcwithers@mercorp.com
Research Institute:
OHIO UNIV.
M. Khairul Alum
Russ College of Eng & Tech
Athens, OH, 45701
(740) 593-1558
Nonprofit college or university
Abstract
This Small business Innovation Research Phase I project, will investigate state-of-the art materials to improve thermal management for high power semiconductor devices in ship board applications. This materials based design approach will utilize ultra highconductivity diamond/metal matrix spreader materials which are coupled to evaporative cooling devices utilizing porous graphite foams to allow effective phase change cooling of high power solid state devices. The result is a robust, light weight and lowcost thermal management system for shipboard applications. Particular attention is paid to the joining of the component parts together to avoid interfacial resistance, using fabrication by liquid metal infiltration to eliminate discontinuous interfaceregions. The tremendous commercial potential of this product is for broad use as a thermal management material in power electronics for SiC, GaAs and Si based devices. Thermal management of all types of power electronics components including GaAs andSiC based devices for space and civilian application.

* information listed above is at the time of submission.

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