Low Cost High Thermal Conductivity Packaging for SiC Based Motor Drive Designs

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$70,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
N65538-04-M-0148
Award Id:
70100
Agency Tracking Number:
N041-095-1303
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
147518286
Principal Investigator:
SionPickard
Senior Scientist
(520) 574-1980
mercorp@mercorp.com
Business Contact:
RaoufLoutfy
President
(520) 574-1980
rloutfy@mercorp.com
Research Institute:
n/a
Abstract
This Small business Innovation Research Phase I project will investigate design and development of SiC based high temperature motor drives. Converter circuit design will be conducted by Rockwell Scientific, to provide high torque output. Innovative high temperature packaging will be developed incorporating high conductivity baseplates composed of ultra high conductivity diamond particles dispersed in a high conductivity metal matrixes known as DiMet materials, integrated with an Aluminum nitride electrical isolation layer to produce the highest conductivity isotropic composite baseplates available today which have high temperature operation capability for SiC packaging. By tailoring the volume loading of diamond in the DiMet, the thermal expansion of the baseplate will be matched with SiC to minimize high temperature thermal mismatch strains. The SiC devices will be directly joined to the baseplate using Transient liquid Phase (TLP) bonding and encapsulated with AlN for high temperature operation. Some limited device testing will be conducted. The tremendous commercial potential of this product is for broad use as a thermal management material in power electronics for SiC, GaAs and Si based devices.

* information listed above is at the time of submission.

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