Lightweight, High Thermal Conductivity Materials for Thermal Management Applications

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$100,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-04-M-0243
Agency Tracking Number:
B041-005-1267
Solicitation Year:
2004
Solicitation Topic Code:
MDA04-005
Solicitation Number:
2004.1
Small Business Information
MATERIALS & ELECTROCHEMICAL RESEARC
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
147518286
Principal Investigator:
Ching-Fong Chen
Senior Scientist
(520) 574-1980
mercorp@mercorp.com
Business Contact:
James Withers
CEO
(520) 574-1980
jcwithers@mercorp.com
Research Institution:
n/a
Abstract
The objective of this proposal is to develop a lightweight, high thermal conductivity material with a tailorable coefficient of thermal expansion for laser technology components leading to higher power lasers. In high performance electronics, packaging is the limiting factor in electrical circuit efficiency. Specifically, thermal management, along with reliability and the trend toward miniaturization, are essential factors in successful electronic design. In addition, the trend toward lightweight packaging is getting more and more attention due to portable handheld devices and space applications. With both the increasing density of components and the increasing power from these components, thermal management materials having high thermal conductivity are needed. Without efficient heat dissipation, the increased laser operating temperatures would lead to increased component failure rates. This program proposes an innovative material that has a thermal conductivity greater than 800 W/m°K, CTE that matches Si and GaAs, and still remains cost effective.

* information listed above is at the time of submission.

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