Lightweight, High Thermal Conductivity Materials for Thermal Management Applications

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: FA9453-04-M-0243
Agency Tracking Number: B041-005-1267
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: MDA04-005
Solicitation Number: 2004.1
Small Business Information
MATERIALS & ELECTROCHEMICAL RESEARC
7960 S. Kolb Rd., Tucson, AZ, 85706
DUNS: 147518286
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ching-Fong Chen
 Senior Scientist
 (520) 574-1980
 mercorp@mercorp.com
Business Contact
 James Withers
Title: CEO
Phone: (520) 574-1980
Email: jcwithers@mercorp.com
Research Institution
N/A
Abstract
The objective of this proposal is to develop a lightweight, high thermal conductivity material with a tailorable coefficient of thermal expansion for laser technology components leading to higher power lasers. In high performance electronics, packaging is the limiting factor in electrical circuit efficiency. Specifically, thermal management, along with reliability and the trend toward miniaturization, are essential factors in successful electronic design. In addition, the trend toward lightweight packaging is getting more and more attention due to portable handheld devices and space applications. With both the increasing density of components and the increasing power from these components, thermal management materials having high thermal conductivity are needed. Without efficient heat dissipation, the increased laser operating temperatures would lead to increased component failure rates. This program proposes an innovative material that has a thermal conductivity greater than 800 W/m°K, CTE that matches Si and GaAs, and still remains cost effective.

* information listed above is at the time of submission.

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