High Temperture, High Power Density Electronic Devices

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$425,000.00
Award Year:
2007
Program:
SBIR
Phase:
Phase II
Contract:
N00024-07-C-4120
Award Id:
70100
Agency Tracking Number:
N041-095-1303
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
147518286
Principal Investigator:
SionPickard
Senior Scientist
(520) 574-1980
mercorp@mercorp.com
Business Contact:
JamesWithers
CEO
(520) 574-1980
jcwithers@mercorp.com
Research Institute:
n/a
Abstract
MER and RSC are developing advanced high temperature electronic packaging for power electronics based on SiC devices which can operate at junction temperatures above 300 degrees C and baseplate temperatures of above 200 degrees C. The packaging is being utilized in a hybrid SiC/Si 3-phase inverter for high power motor drives with output of 15kW. The inverter modules developed in Phase II will contain Si based IGBTs and SiC based Schottky diodes to reduce reverse recovery losses on switching. These motor drives developed in the Phase II program will be of higher reliability and efficiency than present motor drives with reduced requirement for forced air cooling. These inverter modules will be used in a modular design to produce a 50kW and up to a 138kW motor drive for NAVY applications. In the Phase II option, the packaging will undergo only minor modifications to be insertion ready for all SiC components. In the Phase II option the modular inverter design will be cooled by natural convection alone.

* information listed above is at the time of submission.

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