High Temperture, High Power Density Electronic Devices

Award Information
Agency:
Department of Defense
Amount:
$850,000.00
Program:
SBIR
Contract:
N00024-07-C-4120
Solitcitation Year:
2004
Solicitation Number:
2004.1
Branch:
Navy
Award Year:
2007
Phase:
Phase II
Agency Tracking Number:
N041-095-1303
Solicitation Topic Code:
N04-095
Small Business Information
MATERIALS & ELECTROCHEMICAL RESEARCH (ME
7960 S. Kolb Rd., Tucson, AZ, 85706
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
147518286
Principal Investigator
 Sion Pickard
 Senior Scientist
 (520) 574-1980
 mercorp@mercorp.com
Business Contact
 James Withers
Title: CEO
Phone: (520) 574-1980
Email: jcwithers@mercorp.com
Research Institution
N/A
Abstract
MER and RSC are developing advanced high temperature electronic packaging for power electronics based on SiC devices which can operate at junction temperatures above 300°C and baseplate temperatures of above 200°C. The packaging is being utilized in a hybrid SiC/Si 3-phase inverter for high power motor drives with output of 15kW. The inverter modules developed in Phase II will contain Si based IGBTs and SiC based Schottky diodes to reduce reverse recovery losses on switching. These motor drives developed in the Phase II program will be of higher reliability and efficiency than present motor drives with reduced requirement for forced air cooling. These inverter modules will be used in a modular design to produce a 50kW and up to a 138kW motor drive for NAVY applications. In the Phase II option, the packaging will undergo only minor modifications to be insertion ready for all SiC components. In the Phase II option the modular inverter design will be cooled by natural convection alone.

* information listed above is at the time of submission.

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