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Low Cost Si-BN interface Coatings for SiC/SiNC CMCs.

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-05-C-0364
Agency Tracking Number: N052-105-0097
Amount: $150,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N05-105
Solicitation Number: 2005.2
Solicitation Year: 2005
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-09-12
Award End Date (Contract End Date): 2006-03-12
Small Business Information
31304 Via Colinas, Suite 102
Westlake Village, CA 91362
United States
DUNS: 869308346
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 HeeMann Yun
 Director of CMC Development
 (818) 991-8500
Business Contact
 Edward Pope
Title: President
Phone: (818) 991-8500
Research Institution

MATECH GSM proposes to develop a low cost, uniform, reproducible Si-doped BN interface coating process for 3-D and 2-D woven ceramic fiber preforms. Using MATECH's new Reactive Transformation Process (RTP), Si-doped BN interface coatings will be demonstrated on woven SiC ceramic fiber performs without fiber-to-fiber bonding. Key parameters to be investigated will include: 1) Control of interface coating thickness, chemistry, and crystallinity, 2) Uniformity of interface coating thickness and composition, 3) Batch-to-batch reproducibility, 4) Retention of as-received ceramic fiber strength, and 5) Mechanical properties of fully densified SiNC-CMC coupons with RTP-derived Si-doped BN interface coatings. The current "state-of-the-art" process for producing BN inter-phase is chemical vapor infiltration (CVI). One drawback of the CVI BN process is that when a tow (500 to 800 fibers) is formed into a woven fiber preform prior to BN coating, many of the fibers are in contact with each other and therefore do not become completely coated. On subsequent fracture of the composite, those fibers that are in contact with no BN between them tend to fail in a brittle manner, little or no fiber pullout. The RTP coating mitigates these issues.

* Information listed above is at the time of submission. *

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