Novel Lightweight Composites for Pistons

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$100,000.00
Award Year:
1994
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
26668
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Materials Modification, Inc.
2929 Eskridge Road; P-1,, Eskridge Center, Fairfax, VA, 22031
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
T. Sudarshan
(703) 560-1370
Business Contact:
() -
Research Institution:
n/a
Abstract
Carbon-Carbon components, initially developed for the aerospace industry, have experienced minimal commercialization over the past decade due to cost constraints. C-C composites are excellent candidates for a wide variety of components such as automotive clutches, brakes, and liners, due to its friction and heat transfer characteristics. Recently, within the past five (5) years, new C-C processing procedures have significantly reduced the cost of fabrication thus creating expanded opportunities for development of new friction components particularly for applicatoins in the automotive industry. In this proposed Phase I effort, Materials Modifications, Inc., has teamed with the world's leading C-C aircraft brake manufacturer, to develop the sequences required for commercial production of C-C Pistons. Successful design and production of C-C pistons in the Phase I, will permit extensive engine bed testing during Phase II. MMI has initiated early colaboration with major automotive manufacturers for participation in this development and testing effort upon successful development of a cost effective processing procedure. Anticipated Benefits: Cost effective fabrication of C-C pistons will significantly improve performance through increased strength, reduced weight, and reduced friction. Successful testing will lead to other C-C components in the automotive industry such as clutches, sleeves, liners and in the electronics industries in packaging.

* information listed above is at the time of submission.

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