High Temperature Sensor for Consolidation of Refractory Metals and Alloys

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-07-C-0024
Agency Tracking Number: A062-055-0137
Amount: $119,979.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2006
Solicitation Topic Code: A06-055
Solicitation Number: 2006.2
Small Business Information
504 Shaw Road Suite 215, Sterling, VA, 20166
DUNS: 838199099
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Tony Zahrah
 (703) 964-0400
Business Contact
 Tony Zahrah
Title: President
Phone: (703) 964-0400
Email: zahrah@matsys.com
Research Institution
Materials and Manufacturing Systems, Inc. (MATSYS) proposes to develop a high temperature sensor for in situ monitoring and control of consolidation of refractory metals and alloys, especially nanostructured materials. This effort will build on our unique expertise in high temperature eddy current sensing during Hot Isostatic Pressing to design and demonstrate a new generation of high temperature eddy current sensors for consolidation of temperature-sensitive materials. To date the maximum temperature reached with in situ sensor monitoring is about 1200°C. A current unsolved challenge is the consolidation of tungsten and other refractory metal powders, including nanostructured material, that require a maximum temperature above 1200°C for full consolidation. During this proposed project, we will design and fabricate a high temperature sensor using high grade binderless boron nitride and platinum-based wire and associated instrumentation and software that will operate up to a temperature of at least 1650°C. The sensor will be hardened to withstand multiple cycles up to maximum temperature and be applicable to a wide range of materials. Upon successful demonstration, this sensor technology can be easily applied to different refractory powders and will be used to characterize the behavior of this new class of nanostructured materials of interest to the Army.

* Information listed above is at the time of submission. *

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