High-Temperature Adhesive Development

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$79,936.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
N68335-05-C-0019
Agency Tracking Number:
N043-252-0450
Solicitation Year:
2004
Solicitation Topic Code:
N04-252
Solicitation Number:
2004.3
Small Business Information
MAVERICK CORP.
11379 Grooms Road, Blue Ash, OH, 45242
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
879231587
Principal Investigator
 Robert Gray
 President
 (513) 469-9919
 rgray@maverickcorp.com
Business Contact
 Eric W. Collins
Title: Treasurer
Phone: (513) 469-9919
Email: ecollins@maverickcorp.com
Research Institution
N/A
Abstract
The recent development of AFR-PE-4 polyimide composites has increased the high-temperature performance of large jet engine structures. To take full advantage of these "new" composite systems, high-temperature adhesives are needed to bond these components to other structures. Current F135 and F136 engine systems slated for the Joint Strike Fighter (JSF) require high-temperature adhesives that are formulated to provide service temperatures in excess of 316ºC (600ºF) for up to 1,000 hours of operation while retaining a 1,000 psi lap shear strength. Applications for "film" adhesives include honeycomb bonding and stiffening structures, while "paste" adhesives include dams, bonding of fasteners, and gap filler. The overall goal of the program is to formulate addition-cured polyimide resins and study the impact of chemical structure on high temperature properties, adhesion, and joint durability. Maverick will evaluate addition-cured polyimide resin chemistries with the goal of developing the "next-generation" high-temperature adhesive technology for AFR-PE-4 composite components. Maverick also plans to team with Akron Polymer Systems to formulate "reactive diluents," and to work with Adherent Technologies to develop "primer" technology which will "chemically couple" the substrate to the adhesive. This unique collaboration will be key towards the successful development of a high-temperature adhesive system.

* information listed above is at the time of submission.

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