Polymer Dielectrics for Electronics

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$749,743.00
Award Year:
1994
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Award Id:
19589
Agency Tracking Number:
19589
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
140 E. Arrow Highway, San Dimas, CA, 91773
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Ying Wang, Phd
(909) 394-0644
Business Contact:
() -
Research Institute:
n/a
Abstract
WE PROPOSE TO DEVELOP A NEW SERIES OF ADVANCED POLYMERIC MATERIALS FOR A WIDE VARIETY OF ELECTRONICS APPLICATIONS. THESE NOVEL BRANCHED POLYMERS WILL BE PREPARED FROM LOW COST STARTING MATERIALS AND WILL HAVE LOW DIELECTRIC CONSTANT AND HIGH THERMAL STABILITY. POLYMERS WITH SUPERIOR ELECTRICAL, THERMAL AND MECHANICAL PERFORMANCE ARE CRITICAL FOR ADVANCED PACKAGING OF ELECTRONICS INCLUDING PRINTED WIRING BOARD (PWB) AND MULTICHIP MODULE (MCM) DIELECTRICS FOR INTERGRATED CIRCUITS, PASSIVATION LAYERS, LIQUID CRYSTAL DISPLAY (LCD) ORIENTATION LAYERS, LCD COLOR FILTERS, DIELECTRICS FOR CAPACITORS AND WIRE COATING, AND ESSENTIALLY WHEREVER ELECTRICAL INSULATION IS NEEDED. THE CHEMICAL REACTIONS TO MAKE THESE NEW POLYMERS HAVE ALREADY BEEN ESTABLISHED UNDER PROGRAMS AT MAXDEM DIRECTED TOWARDS STRUCTURAL RESINS. WE PROPOSE HERE TO USE THIS CHEMISTRY TO PREPARE POLYMERS WITH STRUCTURES SPECIFICALLY DESIGNED FOR THE NEEDS OF ELECTRONICS APPLICATIONS.

* information listed above is at the time of submission.

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