Polyguinoline Dielectrics as Low Dielectric Packaging

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 19568
Amount: $70,629.00
Phase: Phase I
Program: SBIR
Awards Year: 1993
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
140 E. Arrow Highway, San Dimas, CA, 91773
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Virgil Lee
 (909) 394-0644
Business Contact
Phone: () -
Research Institution
N/A
Abstract
POLYQUINOLINE DIELECTRICS AS LOW DIELECTRIC CONSTANT PACKAGING MATERIALS OFFER MANY ADVANTAGES OVER OTHER ORGANIC POLYMERS (EG. POLYIMIDES) AND INORGANIC MATERIALS. KEY PROPERTIES INCLUDE LOW DIELECTRIC CONSTANT (2.6-2.8), VERY LOW MOITURE UPTAKE (0.15%), AND HIGH THERMAL STABILITY. MANY ELECTRONICS APPLICATIONS REQUIRE PHOTOIMAGEABLE DIELECTRICS AND IN MOST APPLICATIONS FABRICATION IS SIMPLIFIED WITH THE USE OF PHOTOIMAGEABLE POLYQUINOLINE FOR ELECTRICS APPLICATIONS. ADVANCED PACKAGING SYSTEMS SUCH AS MULTI-CHIP MODULES (MCM'S) NOW RELYING ON EXPENSIVE PLASMA ETCHING TECHNOQUES COULD SWITCH TO LOW COST WET ETCHABLE POLYQUINOLINES. WET ETCH METHODS ARE PREVALENT IN JAPAN BUT ALMOST NON-EXISTENT IN THE U.S. IT IS IMPERATIVE THAT U.S. MCM PRODUCERS DEVELOP WET ETCH TECHNIQUES IN ORDER TO COMPETE WITH LOWER COST PRODUCTS FROM OVERSEAS.

* Information listed above is at the time of submission. *

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