Rigid-Rod Polymers for Low Cost MCM's

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 25446
Amount: $746,505.00
Phase: Phase II
Program: SBIR
Awards Year: 1996
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Maxdem, Inc.
140 E. Arrow Hwy., San Dimas, CA, 91773
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Virgil Lee
 (909) 394-0644
Business Contact
Phone: () -
Research Institution
New dielectric films having coefficient of thermal expansion matched to either copper or silicon will be developed based on processable Poly-X (tm) polyphenylenes. These films will have important applications in laminates for Multichip Modules (MCM) and other advanced packaging techniques. The unique combination of rigid-rod backbone and amorphous form will result in film properties not possible with existing materials. Poly-X (tm) resins also have very low dielectric constants and moisture uptake. Anticipated Benefits: Development of low coefficient of thermal expansion dielectric films and laminates will enable low cost fabrication of Multichip Modules.

* information listed above is at the time of submission.

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