Rigid-Rod Polymers for Low Cost MCM's

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$746,505.00
Award Year:
1996
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Agency Tracking Number:
25446
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Maxdem, Inc.
140 E. Arrow Hwy., San Dimas, CA, 91773
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Virgil Lee
(909) 394-0644
Business Contact:
() -
Research Institution:
n/a
Abstract
New dielectric films having coefficient of thermal expansion matched to either copper or silicon will be developed based on processable Poly-X (tm) polyphenylenes. These films will have important applications in laminates for Multichip Modules (MCM) and other advanced packaging techniques. The unique combination of rigid-rod backbone and amorphous form will result in film properties not possible with existing materials. Poly-X (tm) resins also have very low dielectric constants and moisture uptake. Anticipated Benefits: Development of low coefficient of thermal expansion dielectric films and laminates will enable low cost fabrication of Multichip Modules.

* information listed above is at the time of submission.

Agency Micro-sites

US Flag An Official Website of the United States Government