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Continuous Wire Embedded 3D Printing for Sorbent Regeneration

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC22PB082
Agency Tracking Number: 222836
Amount: $149,618.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: H3
Solicitation Number: SBIR_22_P1
Timeline
Solicitation Year: 2022
Award Year: 2022
Award Start Date (Proposal Award Date): 2022-07-22
Award End Date (Contract End Date): 2023-01-25
Small Business Information
200 Yellow Place
Rockledge, FL 32955-5327
United States
DUNS: 175302579
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Benjamin Woods
 (321) 631-3550
 bwoods@mainstream-engr.com
Business Contact
 Kate Wensil
Phone: (321) 631-3550
Email: ksw@mainstream-engr.com
Research Institution
N/A
Abstract

NASA is seeking an advanced heater to replace the current heaters used in the carbon dioxide removal assemblies. The current SOTA spacecraft sorption system utilizes commercial off-the-shelf (COTS) resistive heaters coupled with conductive fins. These current heaters were not manufactured for use on spacecraft, and as such, are sub-optimal, particularly for planned deep space missions. These deep space missions will be power limited and therefore require a more efficient method of sorbent regeneration. To address this need, Mainstream proposes a method of embedding a heating element directly into the sorbent structure. This method will drastically reduce thermal contact resistance, reducing regeneration cycle time and total power input. In Phase I, Mainstream will formulate a zeolite paste capable of being 3D printed into a self-supporting structure, develop the process of embedding the heating elements into the structures, and demonstrate the fabrication of a zeolite structure with embedded heating elements. These tasks will lead to the ultimate goal of printing fully functional replacement sorbent beds with embedded heating elements for existing and planned spacecraft during the Phase II.

* Information listed above is at the time of submission. *

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