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Advanced Cooling System for Modular Power Electronics

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC22CA205
Agency Tracking Number: 211280
Amount: $769,998.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: Z2
Solicitation Number: SBIR_21_P2
Solicitation Year: 2021
Award Year: 2022
Award Start Date (Proposal Award Date): 2022-06-15
Award End Date (Contract End Date): 2024-06-14
Small Business Information
1046 New Holland Avenue
Lancaster, PA 17601-5688
United States
DUNS: 126288336
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Kuan-Lin Lee
 (717) 205-0631
Business Contact
 Leah Robb
Phone: (717) 205-0638
Research Institution

Advanced Cooling Technologies, Inc. (ACT) proposes to develop and mature a compact and effective cooling system for standardized modular power electronics aiming for future space missions. In Phase I, ACT performed a trade study and developed two advanced heat spreaders for 3U electronics cooling: (1) Hi-Ktrade; plate and (2) pulsating heat pipe (PHP) thermal plane. Both heat spreaders outperform the conventional heat spreader (conduction only aluminum plate), and can operate in both vertical and horizontal orientations. PHP is 10% lighter than Hi-Ktrade; plate and aluminum plate. In Phase II, ACT will continue to mature the PHP heat spreader technology and develop the complete cooling system of a Modular Electronics Unit (MEU) for space missions. The thermal performance of the PHP from theoretical models and manufacturability will be evaluated to yield an optimum design applicable for various electronics in Space VPX platforms. To characterize the heat spreader performance under various conditions, both transient and steady-state operation will be tested for high and low heat fluxes, as well as in vacuum, and at system level. The performance of PHPs and Hi-Ktrade; plate will be compared in relevant Space VPX environments. An advanced enclosure with embedded cooling will also be developed to minimize the overall system thermal resistance from the cards to the ultimate heat sink on a spacecraft. The final deliverable will be a flight-like MEU cooling system, consisting of down-selected PHP heat spreaders, enhanced conduction card retainers, and an embedded cooling chassis.

* Information listed above is at the time of submission. *

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