Ballistic Missile System Composite Materials and Structures

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-04-P-0057
Agency Tracking Number: B041-041-1805
Amount: $98,050.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: MDA04-041
Solicitation Number: 2004.1
Small Business Information
150 Dow Street, Tower Two, Manchester, NH, 03101
DUNS: 009254546
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Dignam
 Vice President
 (603) 624-9197
Business Contact
 John Dignam
Title: Vice President
Phone: (603) 624-9197
Research Institution
igh performance interceptors have been pushing material designers to develop low cost radome solutions for the last several decades. Many solutions have been examined and engineered such as silica-silica, Pyroceram, IRBAS, GD-1, Rayceram, and SiN to name a few. Hit-to-kill mission designers have been increasingly pushing the envelope, much to material designers dismay. Despairingly, there has not been one material out of the entire family of ceramic radome solutions that has been a general solution for all mission criteria. Similarly, composite designers have not faired any better. Organic based composite laminates are suitable for low temperature (< 650°F) , low frequency (L,C, and S Band) applications but cannot survive the structural and electrical mission requirements at elevated temperatures. Inorganic laminates, similar to the MSI's quartz/polysiloxane solution can survive temperatures up through 1500°F for short durations (less than 180 seconds), however extending the footprint much beyond those parameters is suspect at this time. MSI's solution has not been subjected to parameters beyond these extremes. The intent of this proposal is to extend the footprint (illustrated in Figure 1.0) of MSI's composite radome solution using a reaction bonded silicon nitride as reinforcement in the laminate.

* Information listed above is at the time of submission. *

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