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MINIATURE CAPILLARY PUMPED HEAT TRANSFER COMPONENT

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 6108
Amount: $49,998.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1987
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
5113 Leesburg Pike - Ste 700
Falls Church, VA 22041
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 MARK D BRYFOGLE
 (703) 998-0922
Business Contact
Phone: () -
Research Institution
N/A
Abstract

THE NATURAL GENERATION OF HEAT WITHIN SEMICONDUCTOR DEVICES CAUSES SEVERAL PROBLEMS ASSOCIATED WITH HIGH OPERATING TEMPERATURES. THESE PROBLEMS INCLUDE POOR ELECTRICAL PERFORMANCE, INHOMOGENEOUS TEMPERATURE PROFILES, THERMAL DIFFUSION, AND THERMAL FATIGUE. THIS RESEARCH EFFORT WILL STUDY THE REDUCTION OF SEMICONDUCTOR JUNCTION TEMPERATURES AND LOCALIZED TEMPERATURE BUILDUPS BY THE FABRICATION OF CAPILLARY TUBES IN THE SUBSTRATE NEAR THE JUNCTION. THE CAPILLARIES WILL CARRY A WORKING FLUID WHICH WILL EXPERIENCE A PHASE CHANGE UPON ABSORPTION OF HEAT IN THE VICINITY OF THE JUNCTION. THE RESULTING VAPOR WILL PASS TO A COLD REGION, WHERE IT WILL CONDENSE AND BE DRAWN INTO THE CAPILLARIES BY CAPILLARY ACTION. A COMPUTER MODEL WILL BE DEVELOPED TO PREDICT THE HEAT TRANSFER CAPABILITIES OF THE DEVICE AND TO POSTULATE AN OPTIMUM DESIGN. THIS OPTIMUM DESIGN WILL BE FABRICATED AND TESTED IN THE LABORATORY DURING PHASE I. HENCE, THE TECHNICAL FEASIBILITY, MANUFACTURABILITY AND COST EFFECTIVENESS OF THIS CONCEPTUAL APPROACH TO ELECTRONICS COOLING WILL BE DEVELOPED AS A RESULT OF PHASE I.

* Information listed above is at the time of submission. *

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