Development of Distributed Electronics Technology for Large-Area, Conformal, and Flexible Surfaces

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-04-C-R302
Agency Tracking Number: 03SB1-0277
Amount: $749,746.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: SB031-019
Solicitation Number: 2003.1
Small Business Information
Long Island High Technology Incubator, Stony Brook, NY, 11790
DUNS: 083265558
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Richard Gambino
 Principal Investigator
 (631) 444-6455
Business Contact
 Jeffrey Brogan
Title: Project Manager and VP Op
Phone: (631) 444-6455
Research Institution
MesoScribe Technologies proposes to expand upon the successful Phase I results to develop Distributed Electronics using the newly developed Direct Write Thermal Spray Technology (DWTS) with the goal of fabricating devices directly onto large area conformal substrates that can provide sensing, information transmission, communications, processing, storage, and signal routing. The Phase II program will focus on three principal thrust areas: (1) the integration of active devices, (2) the enhancement of core capabilities including sensors, passive devices, conductors, etc. and (3) refining the Direct Write fabrication tool to support future transitioning of large area distributed electronics including the ability for portable applications. An interdisciplinary team has been formed consisting of materials and process development (MesoScribe and Stony Brook University), TFT design and testing (Princeton) and application development (EDO-Antenna Products and Technologies, Naval Research Laboratory, Naval Undersea Warfare Center, Airforce Wright Labs, Boeing and Raytheon Corp). The team will focus on enabling the technology with potential applications in distributed antennas, distributed electromagnetics, distributed sensing, and submarine smart-skin concepts. Successful implementation of this Phase II effort will pave the way for an exciting alternative to traditional microelectronics fabrication, in terms of both cost-effective device capabilities onto conformal/flexible surfaces, and technology insertion into defense and commercial applications.

* Information listed above is at the time of submission. *

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