Development of Distributed Electronics Technology for Large-Area, Conformal, and Flexible Surfaces

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$749,746.00
Award Year:
2004
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-04-C-R302
Award Id:
63505
Agency Tracking Number:
03SB1-0277
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Long Island High Technology Incubator, Stony Brook, NY, 11790
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
083265558
Principal Investigator:
Richard Gambino
Principal Investigator
(631) 444-6455
rgambino@mesoscribe.com
Business Contact:
Jeffrey Brogan
Project Manager and VP Op
(631) 444-6455
jbrogan@mesoscribe.com
Research Institution:
n/a
Abstract
MesoScribe Technologies proposes to expand upon the successful Phase I results to develop Distributed Electronics using the newly developed Direct Write Thermal Spray Technology (DWTS) with the goal of fabricating devices directly onto large area conformal substrates that can provide sensing, information transmission, communications, processing, storage, and signal routing. The Phase II program will focus on three principal thrust areas: (1) the integration of active devices, (2) the enhancement of core capabilities including sensors, passive devices, conductors, etc. and (3) refining the Direct Write fabrication tool to support future transitioning of large area distributed electronics including the ability for portable applications. An interdisciplinary team has been formed consisting of materials and process development (MesoScribe and Stony Brook University), TFT design and testing (Princeton) and application development (EDO-Antenna Products and Technologies, Naval Research Laboratory, Naval Undersea Warfare Center, Airforce Wright Labs, Boeing and Raytheon Corp). The team will focus on enabling the technology with potential applications in distributed antennas, distributed electromagnetics, distributed sensing, and submarine smart-skin concepts. Successful implementation of this Phase II effort will pave the way for an exciting alternative to traditional microelectronics fabrication, in terms of both cost-effective device capabilities onto conformal/flexible surfaces, and technology insertion into defense and commercial applications.

* information listed above is at the time of submission.

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