Harsh-Environment Sensors for In-Flight Hypersonic Engine Tests

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-07-M-2748
Agency Tracking Number: F071-190-2086
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solicitation Year: 2007
Solicitation Topic Code: AF071-190
Solicitation Number: 2007.1
Small Business Information
25 Health Sciences Drive, Suite 125, Stony Brook, NY, 11790
DUNS: 083265558
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Christopher Gouldstone
 Project Engineer
 (631) 444-6691
Business Contact
 Jeff Brogan
Title: CEO
Phone: (631) 444-6455
Email: jbrogan@mesoscribe.com
Research Institution
MesoScribe has developed a suite of sensors suited to measuring mechanical and flow properties in harsh environments, such as hypersonic air-breathing propulsion systems. The sensors have been previously demonstrated in airborne and industrial gas turbines, exposed to high temperatures, pressures and g-loading. Using proprietary Direct Write fabrication, a high-precision derivative of thermal spray technology, MesoScribe has the capability to manufacture multilayer sensors, circuit elements, antennas and interconnects directly onto engineering components without clean rooms, lithography or post-processing. The devices produced boast low mass, low profile, high adhesion and high temperature operability. Direct write strain gages are proposed for monitoring duct geometry and flow area. Thermocouples and multilayer thermocouple arrays can measure wall temperature and heat flux, respectively. Thermal-based sensors can measure skin friction through convective power dissipation. Distributed sensor arrays can locate shocks by identifying discontinuities in thermodynamic states within the core flow. Locating these discontinuities and quantifying changes across them further characterizes flow properties along the engine duct. Compatibility of direct-write with thermal spray enables multifunctional coatings to be produced, which comprise discrete sensor layers embedded within thermal barrier or ablative coatings. The flexibility of direct-write allows sensors to be fabricated onto bare substrates with equivalent performance.

* information listed above is at the time of submission.

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