Aware Composite Structures

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-09-M-3921
Agency Tracking Number: F083-178-1412
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: AF083-178
Solicitation Number: 2008.3
Small Business Information
25 Health Sciences Drive, Suite 125, Stony Brook, NY, 11790
DUNS: 083265558
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Christopher Gouldstone
 Project Engineer
 (631) 444-6691
Business Contact
 Jeff Brogan
Title: CEO
Phone: (631) 444-6455
Research Institution
Mesoplasma Direct-Write is a high-precision deposition technology for fabricating multilayer sensors, antennas and interconnects. It is proposed to apply this technology to measuring structural and aerodynamic states of composite structures. This will be achieved, in the case of structural states, by fabricating sensors onto and between laminae. Aerodynamic states will be measured by surface-deposited sensors. Recent work has demonstrated strain gages and thermocouples integrated with composite structures. The proposed effort builds on lessons learnt and expands to new classes of direct write sensor, including a capacitive pressure sensor; a capacitive crack sensor; and a thermally-based stagnation point location sensor. Direct Write sensors will be integrated into a unitized composite structure. Having demonstrated these sensors and embedding within composites, a clear path to Phase II will be outlined, in which full integration will be addressed. BENEFIT: This program will apply MesoScribe’s expertise in low-profile sensor fabrication and composite integration to a new class of sensors for aerodynamic states. Existing capabilities for measuring mechanical (strain, cracks) and thermal states (temperature, heat flux) will be augmented with pressure sensing and stagnation point location. Successful demonstration of these sensor designs will expand MesoScribe’s catalog of sensing capabilities, and allow the Company to exploit more fully the burgeoning market for intelligent structures.

* Information listed above is at the time of submission. *

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