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A High-Performance Silicon-Based Chip Carrier

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-22-C-0083
Agency Tracking Number: N212-132-0489
Amount: $139,996.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N212-132
Solicitation Number: 21.2
Solicitation Year: 2021
Award Year: 2022
Award Start Date (Proposal Award Date): 2021-10-20
Award End Date (Contract End Date): 2022-04-20
Small Business Information
16 Great Hollow Road
Hanover, NH 03755-1111
United States
DUNS: 072021041
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Michael Jaeger
 (603) 640-2431
Business Contact
 Robert Kline-Schoder
Phone: (603) 643-3800
Research Institution

High-precision MEMS inertial sensors needed for military and civilian navigation applications currently lack packaging solutions that preserve MEMS accuracy and sensitivity against thermal cycling, long-term vacuum degradation, and low-level radiation environments. Creare proposes to develop a hermetic, silicon-based leadless chip carrier (LCC) that mitigates MEMS die stress and solder bond stress due to thermal expansion mismatch with the carrier and printed circuit board (PCB) respectively. For long-term MEMS stability, our LCC also provides a sustained high-vacuum environment and provides basic radiation hardness to mitigate electromagnetic interference and energetic particle effects on MEMS accuracy. Our LCC design accommodates tall chip assemblies and provides several low-profile, low-stress options for solder attachment to a PCB. In this Phase I project, Creare will prove the feasibility of the MEMS packaging approach by developing a detailed LCC design and fabrication approach and by modeling and analyzing the package design to estimate the degree to which it protects MEMS devices from thermal, electrical, and radiation effects and meets military performance requirements. In a future Phase II project, we plan to fabricate, test, and deliver prototype chip carriers.

* Information listed above is at the time of submission. *

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