INTELLIGENT SYSTEMS

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: N/A
Agency Tracking Number: 724
Amount: $34,000.00
Phase: Phase I
Program: SBIR
Awards Year: 1983
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Microcirc Associates
102 Scholz Plaza, No. 238, Newport Beach, CA, 92663
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 DR. T.P. HARASZTI
 PRINCIPAL INVESTIGATOR
 () -
Business Contact
Phone: () -
Research Institution
N/A
Abstract
NOVEL ASSOCIATIVE MEMORY CIRCUITS AND PROCESSING ELEMENTS FOR FUTURE PARALLEL DATA PROCESSING AND COMPUTING SYSTEMS ARE PROPOSED FORRESEARCH AND DEVELOPMENT. THESE VLSI CIRCUITS WILL FEATURE HIGH DENSITY, HIGH PERFORMANCE, RADIATION HARDNESS AND WIDE OPERATING TEMPERATURE RANGE. THE MOST PROMISING APPROACH FOR INTELLIGENT NON-VON NEUMAN TYPE OF SYSTEMS HAS BEEN BASED ON ASSOCIATIVE OR CONTENT ADDRESSABLE MEMORIES, BUT THEIR IMPLEMENTATIONS HAS BEEN HINDERED BY THE UNECONOMICAL SIZE AND BY THE SUSCEPTABILITY TO DEVICE PARAMETER VARIATIONS OF THE ASSOCIATIVE MEMORIES. THE MAIN OBJECTIVE OF THIS PROJECT IS TO PROVIDE ASSOCIATIVE MEMORIES AND PROCESSING ELEMENTS FOR ADVANCED ADAPTIVE ARRAY PROCESSORS, WHICH FEATURE THE DENSITY, PERFORMANCE AND RELIABILITY OF COMPARABLE STATIC RANDOM ACCESS MEMORIES. THE EFFORT IN PHASE I WILL INCLUDE FEASIBILITY ESTABLISHMENT OF NOVEL ASSOCIATIVE MEMORY CIRCUITS BY COMPUTER AIDED ANALYSES AND SIMULATIONS AS WELL AS THE DESIGN OF A TEST CHIP. IN PHASE II A COMPLETE CONTENTADDRESSABLE MEMORY AND AN ASSOCIATIVE PROCESSING ELEMENT WILL BE DEVELOPED IN ADDITION TO THE FABRICATION AND EVALUATION OF THE TEST CHIP. THE RESULTS WILL PROVIDE KEY ELEMENTS FOR INTELLIGENT KNOWLEDGE BASED ROBOTS, CONTROLLINGAND PROCESSING SYSTEMS AS WELL AS FOR LARGE COMPUTING PROBLEMS. IN SYSTEMS, THE CHARACTERISTICS OF SPEED, POWER, TOLERANCE TO EXTREME ENVIRONMENTS. WEIGHT RELIABILITY, MAINTENANCE AND LIFE TIME WILL BE IMPROVED.

* information listed above is at the time of submission.

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