Scaleable Process for Integrated, High Frequency Capacitors

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DTRA0102C0074
Agency Tracking Number: 02-0495
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
MICROCOATING TECHNOLOGIES, INC.
5315 Peachtree Industrial Blvd, Atlanta, GA, 30341
DUNS: 806337762
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Todd Polley
 Sr. Research Scientist
 (678) 287-3913
 tpolley@microcoating.com
Business Contact
 Jeffrey Moore
Title: Chief Operating Officer
Phone: (678) 287-2403
Email: jmoore@microcoating.com
Research Institution
N/A
Abstract
Stimulated by the explosive growth in the electronics and telecommunication industries, there is an accelerated demand for high permittivity, thin film capacitors with reduced size for high frequency applications including signal decoupling, filtering, andimpedance matching. Ferroelectric films have outstanding dielectric properties that make them suited for a wide range of capacitor applications, including high frequencies (> 1 GHz). MicroCoating Technologies (MCT) has made rapid progress in developingthe necessary oxide materials, fabricating and testing capacitors, and achieving the commercial goals of the SBIR Phase I. MCT's accomplishments include 1) attracting substantial commercial interest and recruitment of industrial partners and 2) dielectricconstant of 1500 with low leakage (10-7 A/cm2). Phase II targets the development of the novel conductive/ferroelectric materials based capacitors on high Q substrates via CCVD technology. The resultant CCVD prototype equipment will realize at least 30%cost savings compared to pulsed laser deposition and metalorganic CVD systems, while meeting or exceeding device performance requirements. Successful achievement of Phase II goals will result in a commercially viable technology to process ferroelectricfilms on large wafers. Commercialization will occur via a combination of component sales to the market and process licensing with equipment sale to strategic customers.

* information listed above is at the time of submission.

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