Low Cost Fabrication of Diamond Films Using Combustion CVD

Award Information
Agency:
Department of Defense
Amount:
$70,000.00
Program:
STTR
Contract:
F33615-02-M-2297
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Missile Defense Agency
Award Year:
2002
Phase:
Phase I
Agency Tracking Number:
02-0070T
Solicitation Topic Code:
N/A
Small Business Information
Microcoating Technologies, Inc.
5315 Peachtree Industrial Blvd., Atlanta, GA, 30341
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
806337762
Principal Investigator
 Zhiyong Zhao
 Sr. Research Scientist
 (678) 287-3944
 zzhao@microcoating.com
Business Contact
 David Motley
Title: Executive VP, Marketing
Phone: (678) 287-2445
Email: dmotley@microcoating.com
Research Institution
 North Carolina State University
 Zlatko Sitar
 Dep. of Matls Science & Eng., 1001 Capability Dr., Box 7919
Raleigh, NC, 27695
 (919) 515-8637
 Nonprofit college or university
Abstract
"Diamond represents a multimillion market due to its unique combination of superior thermal, electronic, optical, dielectric, chemical, and mechanical properties. However its applications are far from fully developed. One of the hurdles is the lack of asuitable technique to make high quality diamond with low cost comparable to that of other materials in various application areas. MicroCoating Technologies (MCT) proposes to synthesize thin film diamond at lower cost utilizing its proprietary Nanomisertechnology and Combustion Chemical Vapor Deposition (CCVD) process, and expertise in thin film deposition targeting applications in thermal management and electronics. Professor Zlatko Sitar at North Carolina State University, an expert in heteroepitaxialgrowth of diamond thin films, will collaborate with MCT on this Phase I effort. This novel concept, if successful, will result in a low cost, high quality platform for enormous electronic devices, enabling its widespread commercial and military uses.Envisioned applications include, but not limited to, field emission displays, electronic packaging, thermal management, super capacitors, IR windows, piezoresistive sensors, gas sensors, and surface acoustic wave devices."

* information listed above is at the time of submission.

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